NXP Semiconductors partners with AWS to accelerate semiconductor innovation. By moving EDA workloads to the cloud, NXP aims to improve productivity, reduce time-to-market, and deliver cutting-edge products.
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| NXP Semiconductors has expanded its partnership with AWS to migrate its EDA workloads to the cloud, accelerating semiconductor design and development for various applications. Image Courtesy: Amazon |
Seattle, Washington, USA - September 21, 2024:
NXP Semiconductors, a leading provider of secure connectivity solutions, has announced an expanded collaboration with Amazon Web Services (AWS) to further accelerate its semiconductor design and development process. By moving a majority of its electronic design automation (EDA) workloads to AWS, NXP aims to leverage the cloud platform's performance, scalability, and security to deliver innovative solutions across various industries.
The partnership builds on a three-year collaboration between NXP and AWS, during which NXP has successfully completed the deployment of its end-to-end semiconductor chip design on the AWS cloud. The company established a cloud center of excellence (CCoE) to streamline this migration, ensuring effective governance, employee training, and application development standardization.
One of the key benefits of using AWS is the ability to access advanced global infrastructure capabilities in high performance computing, artificial intelligence, and machine learning. NXP has recently executed a full system-on-a-chip design, including simulation and tape-out, for its leading-edge vehicle integration processor, leveraging AWS's services.
This expanded collaboration between NXP and AWS highlights the growing trend of semiconductor companies adopting cloud-based solutions to enhance their design and development processes. By leveraging AWS's capabilities, NXP can improve productivity, reduce time-to-market, and deliver innovative products that meet the evolving demands of various industries.