SK hynix ships the world’s first 12-layer HBM4 samples, offering groundbreaking performance for AI applications. The company is set to lead the next-gen AI memory market.
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| SK hynix ships the first-ever 12-layer HBM4 samples, revolutionizing the AI memory market with unmatched capacity and speed, setting new standards for DRAM performance. Image: SK hynix |
Seoul, South Korea — March 19, 2025:
SK hynix Inc. has announced the successful shipment of the world’s first 12-layer HBM4 (High Bandwidth Memory) samples to major customers, marking a significant advancement in the field of AI memory. The samples, which were delivered ahead of schedule, demonstrate the company’s leadership in the HBM market, driven by its technological expertise and extensive production experience.
The 12-layer HBM4 is a groundbreaking product, featuring the industry's best bandwidth and capacity required for AI applications. For the first time, the product boasts a bandwidth capable of processing more than 2TB (terabytes) of data per second, allowing it to process over 400 full-HD movies (5GB each) in a second. This performance exceeds the previous generation, HBM3E, by more than 60%, setting a new benchmark for AI memory.
SK hynix employed its Advanced MR-MUF process to enhance the product’s capabilities, achieving a capacity of 36GB, the highest among 12-layer HBM products. This innovative process improves product stability by preventing chip warpage and optimizing heat dissipation, ensuring high performance and reliability.
This achievement follows SK hynix’s industry-leading milestones, including the mass production of HBM3 in 2022 and 8- and 12-high HBM3E in 2024. The company has been at the forefront of the AI memory market, supplying cutting-edge HBM products to meet growing customer demand.
“We have solidified our position as a leader in the AI ecosystem, thanks to years of overcoming technological challenges and aligning with customer needs,” said Justin Kim, President & Head of AI Infrastructure at SK hynix. "With our experience as the largest HBM provider, we are now prepared to move forward with certification and mass production, continuing to push the boundaries of what’s possible in AI memory.”
With mass production expected to begin in the second half of 2025, SK hynix’s 12-layer HBM4 is set to play a pivotal role in advancing AI technologies, offering unparalleled performance for next-generation applications.